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Shenzhen Yizhuo Electronics Co., Ltd
Shenzhen Yizhuo Electronics Co.,Ltd has been established in 2012 years, Our factory area more than 5,000 square meters. We have more than 100 workers and 20 employees.We are Aluminum PCB and FR4 PCB
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Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board

Shenzhen Yizhuo Electronics Co., Ltd
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Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board

Brand Name : Yizhuo

Model Number : Aluminum Pcb Board 01

Certification : CE,ROHS,UL

Place of Origin : China

MOQ : 2PCS

Payment Terms : T/T, Western Union

Delivery Time : 10-12 work days

Packaging Details : Vacuum Package+ Good quality carton box

Base Material : Aluminum Base

Copper Thickness : 1/2OZ

Peelable : 0.3-0.5mm

Profiling Punching : Routing, V-CUT, Beveling

Service : One-stop service

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Aluminum Base PCB Gold Plated 2oz Copper Printed Circuit Board
Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board

  1. EMS-Electronic Manufacturing Service
  2. PCB design and PCB Layout
  3. PCB Assembly on SMT, BGA, and DI
  4. Cost-Effective Components Sourcing
  5. Fast Turn Prototype and Mass Production
  6. Box Build Assembly
  7. Engineering Support
  8. Tests(X-ray, 3D Paste Thickness, ICT, AOI, and Functional tests)
  9. Logistics and After-sales Service


Fr4 Base PCB Gold Plated 2oz Copper Printed Circuit Board
PCB PRODUCTION CAPACITY

PCB layers 1-layer to 10-layer(including HDI board)
Finish type Gold-plated,Immersion gold-plated, HAL finish , Flux., Carbon -bridge, Entek, Nickel plating
Base material FR4,CEM-1,CEM-3,FR1,FR2, Aluminium metal substrate and Rogers
Base material thickness 0.4-2.4mm.
Copper foil thickness 18um(H/HOZ) ,35um(1/1OZ) ,70um(2/2OZ), 5OZ
Maximum-product board 500*700mm. For AL PCB: 500*1400mm
Minimum drilled hole size 0.075mm
Minimum track width/spacing 3mil
Average hole wall copper Thickness for HAL board: ≥25um.Gold-finger plating: ≥0.1um
Solder mask ink Photo cure ink, heat cure ink. UV ink
Outline tolerance ±0.1mm
Hole diameter tolerance/ Hole location tolerance ±0.076mm/±0.076mm
V-CUT tolerance ±0.1mm.
Warp According to the IPC-600F standard
lead time Single-sided: 2-3 working days; Double-sided: 3-4 working days; Multi-layer: 8-10 working days

PCBA MANUFACTURING CAPABILITY

PCB assembly Layers 1 Layer to 36 layers (standard),
PCB assembly material/type FR4, Aluminum, CEM1, Super-thin PCB, FPC/Gold finger
PCB Assembly service type DIP/SMT or Mixed SMT & DIP
Copper thickness 0.5um-4um
Assembly surface finish HASL,ENIG,OSP
PCB Dimension 600x1200mm
IC Pitch(min) 0.2mm
Chip Size(min) 01005
Leg distance(min) 0.3mm
PCB BGA Size 8x6mm~55x55mm
IC Encapsulation type SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
u-BGA ball dia. 0.2mm
Required Docs for PCBA Gerber file with BOM list & Pick-N-Place File(XYRS)
SMT speed CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs



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